Chemical mechanical polishing (solid reaction) process

MP is the workpiece against the rotation of the elastic pad (polishing pad) on the use of the relative motion of polishing technology for processing. The corrosive processing liquid supplied onto the workpiece when the workpiece by etching process (chemical) when, while supplying ultrafine grain (100 nm in diameter or less) polishing (mechanical) materials, the convex portion ed workpiece of polishing operations, it said machine (mechanical) chemical polishing or chemical mechanical polishing.